Features

Flexible Logic Architecture

•Six devices with 256 to 6864 LUT4s and 18 to 334 I/Os

Ultra Low Power Devices

•Advanced 65 nm low power process

•As low as 22µW standby power

•Programmable low swing differential I/Os

•Stand-by mode and other power saving options

Embedded and Distributed Memory

•Up to 240 kbits sysMEM™Embedded Block RAM

•Up to 54 kbits Distributed RAM

•Dedicated FIFO control logic

On-Chip User Flash Memory

•Up to 256 kbits of User Flash Memory

•100,000 write cycles

•Accessible through WISHBONE,SPI,I2C and JTAG interfaces

•Can be used as soft processor PROM or as Flash memory

Pre-Engineered Source Synchronous I/O

•DDR registers in I/O cells

•Dedicated gearing logic

•7:1 Gearing for Display I/Os

•Generic DDR,DDRX2,DDRX4

•Dedicated DDR/DDR2/LPDDR memory with DQS support

High Performance,Flexible I/O Buffer

•Programmable sysIO™buffer supports wide range of interfaces:

–LVCMOS 3.3/2.5/1.8/1.5/1.2

–LVTTL

–PCI

–LVDS,Bus-LVDS,MLVDS,RSDS,LVPECL

–SSTL 25/18

–HSTL 18

–Schmitt trigger inputs,up to 0.5 V hysteresis

•I/Os support hot socketing

•On-chip differential termination

•Programmable pull-up or pull-down mode

Flexible On-Chip Clocking

•Eight primary clocks

•Up to two edge clocks for high-speed I/O interfaces(top and bottom sides only)

•Up to two analog PLLs per device with fractional-n frequency synthesis

–Wide input frequency range(7 MHz to 400 MHz)

Non-volatile,Infinitely Reconfigurable

•Instant-on–powers up in microseconds

•Single-chip,secure solution

•Programmable through JTAG,SPI or I2C

•Supports background programming of non-volatile memory

•Optional dual boot with external SPI memory

TransFR™Reconfiguration

•In-field logic update while system operates

Enhanced System Level Support

•On-chip hardened functions:SPI,I2C,timer/counter

•On-chip oscillator with 5.5%accuracy

•Unique TraceID for system tracking

•One Time Programmable(OTP)mode

•Single power supply with extended operating range

•IEEE Standard 1149.1 boundary scan

•IEEE 1532 compliant in-system programming

Broad Range of Package Options

•TQFP,WLCSP,ucBGA,csBGA,caBGA,ftBGA,fpBGA,QFN package options

•Small footprint package options

–As small as 2.5 mm x 2.5 mm

•Density migration supported

•Advanced halogen-free packaging